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 SUP90N08-8M2P
Vishay Siliconix
N-Channel 75-V (D-S) MOSFET
PRODUCT SUMMARY
V(BR)DSS (V) 75 rDS(on) () 0.0082 at VGS = 10 V ID (A) 90d Qg (Typ) 58
FEATURES
* TrenchFET(R) Power MOSFET * 175 C Junction Temperature * 100 % Rg and UIS Tested
RoHS
COMPLIANT
APPLICATIONS
* Power Supply - Secondary Synchronous Rectification * Industrial
TO-220AB
D
G
GDS Top View Ordering Information: SUP90N08-8M2P-E3 (Lead (Pb)-free) S N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 175 C) Pulsed Drain Current Avalanche Current Single Avalanche Energy
a
Symbol VDS VGS TC = 25 C TC = 70 C ID IDM IAS L = 0.1 mH TC = 25 C TA = 25 Cc EAS PD TJ, Tstg
Limit 75 20 90d 79d 200 50 125 150
b
Unit V
A
mJ W C
Maximum Power Dissipationa Operating Junction and Storage Temperature Range
3.75 - 55 to 175
THERMAL RESISTANCE RATINGS
Parameter Junction-to-Ambient (PCB Mount) Junction-to-Case (Drain) Notes: a. Duty cycle 1 %. b. See SOA curve for voltage derating. c. When Mounted on 1" square PCB (FR-4 material). d. Package limited. Document Number: 69615 S-72504-Rev. A, 03-Dec-07 www.vishay.com 1
c
Symbol RthJA RthJC
Limit 40 1
Unit C/W
SUP90N08-8M2P
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Dynamicb Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Gate Resistance Turn-On Delay Time Rise Timec Turn-Off Delay Time Fall Timec Continuous Current Pulsed Current Forward Voltagea Reverse Recovery Time Peak Reverse Recovery Current Reverse Recovery Charge
c c
Symbol V(BR)DSS VGS(th) IGSS IDSS ID(on) rDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf
b
Test Conditions VDS = 0 V, ID = 250 A VDS = VGS, ID = 250 A VDS = 0 V, VGS = 20 V VDS = 60 V, VGS = 0 V VDS = 60 V, VGS = 0 V, TJ = 125 C VDS = 60 V, VGS = 0 V, TJ = 150 C VDS 10 V, VGS = 10 V VGS = 10 V, ID = 20 A VGS = 10 V, ID = 20 A, TJ = 125 C VDS = 15 V, ID = 30 A
Min 75 2.8
Typ
Max
Unit
4.8 250 1 50 250
V nA A A
70 0.0069 0.0116 55 3528 0.0082 0.014
S
VGS = 0 V, VDS = 30 V, f = 1 MHz
470 178 58 90
pF
VDS = 38 V, VGS = 10 V, ID = 15 A f = 1 MHz VDD = 38 V, RL = 3.1 ID 12.5 A, VGEN = 10 V, Rg = 1
21 16 1.8 21 15 32 10 3.5 35 25 55 20
nC
ns
Source-Drain Diode Ratings and Characteristics TC = 25 C IS ISM VSD trr IRM(REC) Qrr
83 200 IF = 30 A, VGS = 0 V IF = 75 A, di/dt = 100 A/s 0.85 61 2.7 83 1.5 100 4.5 140
A V ns A nC
Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 69615 S-72504-Rev. A, 03-Dec-07
SUP90N08-8M2P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
200 180 160 140 I D - Drain Current (A) 120 100 80 6V 60 40 20 0 0 1 2 3 4 5 6 7 8 9 10 4V 5V 0 0 1 2 3 4 5 6 7 8 9 10 I D - Drain Current (A) 7V VGS = 10 thru 8 V 160 200
120
80 TC = 125 C TC = 25 C TC = - 55 C
40
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
90 80 70 g fs - Transconductance (S) 60 50 40 30 20 10 0 0 10 20 30 40 50 60 0.00 4 5 125 C TC = - 55 C r DS(on) - On-Resistance () 0.20
Transfer Characteristics
ID = 30 A
25 C
0.15 TA = 25 C 0.10
0.05 TA = 150 C
6
7
8
9
10
I D - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
Transconductance
0.009 r DS(on) - D to S On-Resistance ()
On-Resistance vs. Gate-to-Source Voltage vs. Temperature
4500 4000
0.008 C - Capacitance (pF)
Ciss 3500 3000 2500 2000 1500 1000 500 Coss Crss 0 10 20 30 40 50 60 70 80
0.007
VGS = 10 V
0.006
0.005
0.004 0 20 40 60 80 100 120 140 160 180 200
0
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current Document Number: 69615 S-72504-Rev. A, 03-Dec-07
Capacitance www.vishay.com 3
SUP90N08-8M2P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
2.5 1.0
2.0 r DS(on) - On-Resistance (Normalized) ID = 30 A, VGS = 10 V 1.5 V GS(th) Variance (V)
0.5
0.0 ID = 5 mA - 0.5 ID = 250 A
1.0
- 1.0
0.5
- 1.5
0.0 - 50
- 25
0
25
50
75
100
125
150
175
- 2.0 - 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (C)
TJ - Junction Temperature (C)
On-Resistance vs. Junction Temperature
10 ID = 15 A VGS - Gate-to-Source Voltage (V) VDS = 38 V 8 V(BR)VDSS (normalized) VDS = 60 V 90 95
Threshold Voltage
ID = 250 A 85
6
4
80
2
75
0 0 10 20 30 40 50 60
70 - 50
- 25
0
25
50
75
100
125
150
175
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
100 120
On-Resistance vs. Junction Temperature
10 IS - Source Current (A) I D - Drain Current (A) TJ = 25 C TJ = 150 C 1.0
100
80
60
0.1
40
0.01
20
0.001 0.0 0.2 0.4 0.6 0.8 1.0
0 0 25 50 75 100 125 150 175 VSD - Source-to-Drain Voltage (V) TC - Case Temperature (C)
Source-Drain Diode Forward Voltage
Maximum Drain Current vs. Case Temperature
www.vishay.com 4
Document Number: 69615 S-72504-Rev. A, 03-Dec-07
SUP90N08-8M2P
Vishay Siliconix
TYPICAL CHARACTERISTICS
100
25 C, unless otherwise noted
1000 Limited by rDS(on)*
100 I D - Drain Current (A) 0.1 s 10 1s 10 s DC
I DAV (A)
1
0.1
0.01
TC = 25 C Single Pulse 1 * VGS 10 100 1000
10
0.000001
0.000010
0.0001
t in (s)
0.001
0.01
0.001 0.1
Single Pulse Avalanche Current Capability vs. Time
VDS - Drain-to-Source Voltage (V) minimum VGS at which rDS(on) is specified
Safe Operating Area
1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance 0.2 0.1 0.05 0.1 0.02 Single Pulse
0.01 10-4 10-3 10-2 Square Wave Pulse Duration (s) 10-1 1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?69615.
Document Number: 69615 S-72504-Rev. A, 03-Dec-07
www.vishay.com 5
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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